Effect of lead position and orientation on electromagnetic interference in patients with bipolar cardiovascular implantable electronic devices

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Abstract

Aims Electromagnetic interferences (EMIs) with cardiovascular implantable electronic devices (CIEDs) are associated with potential risk for patients. Studies imply that CIED sensitivity setting and lead's tip-to-ring spacing determine the susceptibility of CIEDs with bipolar leads to electric and magnetic fields (EMFs); however, little is known about additional decisive parameters affecting EMI of CIEDs.We therefore investigated the influence of different patient-, device-, and lead-depending variables on EMIs in 160 patients. Methods and results We ran numerical simulations with human models to determine lead-depending variables on the risk of EMI by calculating the voltage induced in bipolar leads from 50/60 Hz EMF. We then used the simulation results and analysed 26 different patient-, device-, and lead-depending variables with respect to the EMI threshold of 160 CIED patients. Our analyses revealed that a horizontal orientation and a medial position of the bipolar lead's distal end (lead-tip) are most beneficial for CIED patients to reduce the risk of EMI. In addition, the effect of CIED sensitivity setting and lead's tip-to-ring spacing was confirmed. Conclusion Our data suggest that in addition to the established influencing factors, a medial position of the lead-tip for the right ventricular lead as achievable at the interventricular septum and a horizontal orientation of the lead-tip can reduce the risk of EMI. In the right atrium, a horizontal orientation of the lead-tip should generally be striven independent of the chosen position. Still important to consider remains a good intrinsic sensing amplitude during implant procedure.

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Seckler, T., Stunder, D., Schikowsky, C., Joosten, S., Daniel Zink, M., Kraus, T., … Napp, A. (2017). Effect of lead position and orientation on electromagnetic interference in patients with bipolar cardiovascular implantable electronic devices. Europace, 19(2), 319–328. https://doi.org/10.1093/europace/euv458

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