Pd Nanoparticles as a New Activator for Electroless Copper Deposition

  • Lee C
  • Wan C
  • Wang Y
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Abstract

Pd nanoparticles were synthesized and finely controlled by the proper choice of surfactants with different carbon chain lengths. The feasibility of using this newly synthesized Pd nanoparticles as an activator for electroless copper deposition was examined. In this study, copper was successfully deposited on a wafer with a 0.25 mum microtrench. In addition, the effects of the surrounding functional group and the particle size on the kinetics of electroless copper deposition were studied by electrochemical quartz crystal microgravimetry. The performance of Pd nanoparticles was also compared with the traditional Pd/Sn colloid-type activator. (C) 2003 The Electrochemical Society.

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Lee, C.-L., Wan, C.-C., & Wang, Y.-Y. (2003). Pd Nanoparticles as a New Activator for Electroless Copper Deposition. Journal of The Electrochemical Society, 150(3), C125. https://doi.org/10.1149/1.1542899

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