Damage Metrics for Void Detection in Adhesive Single-Lap Joints

Abstract

Structural Health Monitoring (SHM) techniques, such as Electromechanical Impedance Spectroscopy (EMIS), aim to continuously monitor structures for defects, thus avoiding the need for regular maintenance. While attention has been given to the application of EMIS in the automatic detection of damage in metallic and composite components, integrity monitoring of structural adhesive joints has been comparatively neglected. This paper investigated the use of damage metrics with electrical impedance measurements to detect defects in Single-Lap Joints (SLJs) bonded with a modified epoxy adhesive. Traditional metrics using statistical and distance-based concepts, such as the Root-Mean-Squared Deviation, (Formula presented.), or the Correlation Coefficient, (Formula presented.), are addressed at detecting voids in the adhesive layer and are applied to five different spectral frequency ranges. Furthermore, new damage metrics have been developed, such as the Average Canberra Distance, (Formula presented.), which enables a reduction of possible outliers in damage detection, or the complex Root-Mean-Squared Deviation, (Formula presented.), which allows for the use of both the real and imaginary components of the impedance, enabling better damage detection in structural adhesive joints. Overall, damage detection is achieved, and for certain spectral conditions, differentiation between certain damage sizes, using specific metrics, such as the (Formula presented.) or (Formula presented.), may be possible. Overall, the (Formula presented.) or (Formula presented.) values from damaged SLJs tend to be double the metric values from undamaged joints.