Conference ProceedingsOPEN ACCESS

Review on the effect of Gallium in solder alloy

IOP Conference Series: Materials Science and Engineering (2020) 957(1)
DOI: 10.1088/1757-899X/957/1/012054
4Citations
Citations of this article
5Readers
Mendeley users who have this article in their library.

This article is free to access.

Abstract

Soldering is a well-known metallurgical joining method that uses a filler metal, the solder, with a melting point below 425 C. The trends toward to miniaturization in microelectronic packaging industries have motivated the development of high performance lead-free solders. However, the properties of the lead free solder cannot match the properties of lead solder. To overcome this problem, a dopant is added to the based lead free solder. In this paper, review on the effect of Gallium as doped was discussed.

Cite

CITATION STYLE

APA

Ervina Efzan, M. N., & Nur Faziera, M. N. (2020). Review on the effect of Gallium in solder alloy. In IOP Conference Series: Materials Science and Engineering (Vol. 957). IOP Publishing Ltd. https://doi.org/10.1088/1757-899X/957/1/012054

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free