New Pb-free solder alloy with superior mechanical properties

Abstract

New high-strength Pb-free solder alloys, based on the Sn-Ag-Zn system, have been developed. A relatively small addition of Zn significantly improves the mechanical strength of Sn-3.5% Ag eutectic solders while maintaining the same level of ductility. The observed increase in strength is as much as 48% over that of the Zn-free alloy. This strengthening from the Zn additions is attributed to a substantial refinement of the precipitates in the solidification microstructure. The problems of nonuniformity in solidification dendrite structure and solder surface roughness often observed in the Sn-Ag binary alloys are also alleviated by the Zn addition. It is found that essentially all of the added Zn resides in the more corrosion-resistant, Ag-based, intermetallic precipitates, leaving the Sn-rich matrix primarily free of Zn in solid solution. High-temperature creep tests indicate that the new Zn-containing alloys exhibit a remarkably improved creep resistance of more than an order of magnitude.