Journal ArticleOPEN ACCESS

Additive manufacturing for 3d electronic applications

Journal of Japan Institute of Electronics Packaging (2020) 23(6) 452-458
DOI: 10.5104/jiep.23.452
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Maruo, S. (2020). Additive manufacturing for 3d electronic applications. Journal of Japan Institute of Electronics Packaging, 23(6), 452–458. https://doi.org/10.5104/jiep.23.452

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