Development of multi-pitch tool path in computer-controlled optical surfacing processes

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Abstract

Background: Tool path in computer-controlled optical surfacing (CCOS) processes has a great effect on middle spatial frequency error in terms of residual ripples. Raster tool path of uniform path pitch is one of the mostly adopted paths, in which smaller path pitch is always desired for restraining residual ripple errors. However, too dense paths cause excessive material removal in lower removal regions deteriorating the form convergence. Methods: With this in view, we propose a novel tool path planning method named multi-pitch path. With the path, the material removal map is divided into several regions with varied path pitches according to the desired removal depth in each region. The path pitch is designed larger at low removal regions while smaller at high removal regions, and the feeding velocity of the tool is maintained at high level when scanning the whole surface. Results and conclusions: Experiments were conducted to demonstrate this novel tool path planning method, and the results indicate that it can successfully restrain the residual ripples, and meanwhile guarantee favorable convergent rate of form error.

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Hou, J., Liao, D., & Wang, H. (2017). Development of multi-pitch tool path in computer-controlled optical surfacing processes. Journal of the European Optical Society, 13(1). https://doi.org/10.1186/s41476-017-0050-z

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