Research on single-event transient mechanism in a novel SOI CMOS technology

Abstract

For the first time, compared with common bulk PMOSFETs, single-event transient (SET) mechanism was researched in a novel SOI PMOSFETs using technology computer-aided design mixed-mode numerical (TCAD) simulations. The simulation results showed that, different from the common bulk CMOS technology, diffusion but not bipolar effect is the main mechanism in PMOSFETs fabricated in this novel SOI CMOS technology. The effects of buried oxide (BOX) layer and body tie on SET were also discussed for the PMOSFETs in this technology. The radiation hardened by design (RHBD) layout technique was proposed for further SET mitigation. All of the studies indicated that this novel SOI CMOS technology has the essential advantage for radiation hardened integrated circuit (IC) design.