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Gold bonding wire for semiconductor applications

Gold Bulletin (1982) 15(2) 43-50
DOI: 10.1007/BF03214605
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Abstract

Because of the ease with which gold wire can be bonded by modern techniques, it is used extensively for making connections to or between the active components in semiconductor devices such as transistors and integrated circuits. This article reviews some of the important properties of gold bonding wire and discusses trends in its use in industry. © 1982 World Gold Council.

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APA

Tomiyama, S., & Fukui, Y. (1982). Gold bonding wire for semiconductor applications. Gold Bulletin, 15(2), 43–50. https://doi.org/10.1007/BF03214605

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