Thin AC-PDP Vacuum In-line Sealing Using Direct-Joint Packaging Method

Abstract

In this work, we have improved vacuum in-line sealing technologies for plasma display panels (PDPs) using the direct-joint packaging method, which is different from the conventional packaging method in the aspects of exhaust hole and tube. We use the glass frit and B-stage organic binder materials for packaging. The sintering process is performed for both materials before packaging to reduce out-gassing and to optimize conditions. To get the high vacuum conductance, we suggest the lump structure on seal-line. The vacuum conductance using lump structures provides better pumping efficiency than tube packaging by theoretical calculation. The packaging temperatures for glass frit and organic binder are 380 and 175°C, respectively. The 4 in. alternating current (ac)-PDP is successfully packaged in He-Ne(27%)-Xe(3%) ambient and fully emitted with brightness of about 1000 cd/m 2 . The long-term reliability of packaged PDP is evaluated through both the light emission characteristics and a driving test for one year. This method has the advantages of a simple, brief, low cost process, improved gas uniformity by high vacuum efficiency, and thin panel fabrication achieved by the removal of the exhaust hole and tube. © 2004 The Electrochemical Society. All rights reserved.