Numerical Simulation of Laser Soldering Process on Pin Through Hole (PTH)

Abstract

The increasing demands in the miniaturization of microelectronic products promotes the automation of electronic assembly and manufacturing process such as laser soldering to deliver high quality and flexibility of solder joints. This paper investigates possibility of using computational fluid dynamics (CFD) to create simulation of laser soldering process. Heating process of solder phase was simulated Using finite volume method (FVM) and energy equation enabled. Results of the simulation was compared with experiment for validation. Generally, it is found that the solder formation is identical for both simulation and experimental process. Moreover, the temperature distribution shows that heating process of laser soldering has great heating distribution along the solder region.