3D integration of micro optical components on flexible transparent substrate with through-hole-vias

Abstract

This study establishes the polymer-stacking and metal-electroplating processes on Si-substrate to implement a flexible and transparent substrate with alignment mesa, distributed though-hole-vias, and multi-layer electrical routings. This process is especially useful for 3D integration of micro optical components on flexible substrate. The integrated chips can be further protected and sealed by an additional parylene coating. More micro-optical components can also be vertically integrated by additional polymer molding. To demonstrate the feasibility of this approach, LED chips are bonded and sealed in flexible substrate, and the polymer microlens is further integrated with the lighting chips using molding process. The lighting of packaged LED chips is demonstrated in both air and water. ©2010 IEEE.