Formation and characterization of inkjet-printed nanosilver lines on plasma-treated glass substrates

Abstract

In this study, we investigated geometrical characteristics of the inkjet-printed lines with non-zero receding contact angle (CA) on plasma-treated substrates in terms of various printing variables and analyzed the fluidic behavior and hydrodynamic instability involved in the line formation process. The printing variables included surface energy, droplet overlap ratio, printing frequency, a number of ink droplets, substrate temperature and printing procedures. For the study, a colloidal suspension containing 56 wt % silver nanoparticles in tetradecane solvent was used as a printing ink. It has electrical resistivity of 4.7 μΩcm. The substrates were obtained by performing a plasma enhanced chemical vapor deposition (PECVD) process with C4F8 and O2 under various treatment conditions. As results of the experiments, the surface shape and pattern of the inkjet-printed Ag lines were dominantly influenced by the surface energy of the substrates, among the printing variables. Accordingly even when the receding CA was non-zero, bulging instability of the lines occurred forming separate circular patterns or regular bulges connected by ridges. It is a new finding of this study, which is completely different with the bulging instability of inkjet lines with zero receding CA specified by previous researches. The bulging instability decreased by increasing surface temperature of the substrates or employing interlacing procedure instead of continuous procedure for printing. The interlacing procedure also was advantageous to fabricate thick and narrow Ag lines with well-defined shape through overprinting on a hydrophobic substrate. These results will contribute greatly to not only the production of various printed electronics containing high-aspect-ratio structures but also the improvement of working performance of the devices.