Steady Heat Transfer to Laminar Flow Between Parallel Plates with Conduction in Wall

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Abstract

For the case where constant heat flux or constant temperature was given at both outer surfaces of parallel plates, a theoretical analysis was made, assuming that temperature distribution at inner surface was represented by a power series. For example, numerical calculations of the theoretical result were carried out for several conditions at Pé= 500. Influences of wall thickness and ratio of thermal conductivity of wall to that of fluid on distributions of interfacial temperature and local Nusselt number were examined concretely. For the case of constant heat flux, the influence was significant for large values of the conductivity ratio. For the case of constant temperature, on the contrary, the influence was significant for small values. Experiments were carried out for the case of constant temperature at the outer surfaces. The experimental results were in good agreement with theoretical values. © 1975, The Society of Chemical Engineers, Japan. All rights reserved.

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Mori, S., Shinke, T., Sakakibara, M., & Tanimoto, A. (1975). Steady Heat Transfer to Laminar Flow Between Parallel Plates with Conduction in Wall. KAGAKU KOGAKU RONBUNSHU, 1(3), 235–240. https://doi.org/10.1252/kakoronbunshu.1.235

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