Abstract
In this paper specific advantages and disadvantages of different pulse magnetron sputtering processes (unipolar and bipolar pulse sputtering at high and very high power density including HIPIMS) as well as current and potential fields of application will be discussed.
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CITATION STYLE
APA
Frach, P., Gottfried, C., Fietzke, F., Klostermann, H., Bartzsch, H., & Gloess, D. (2013). High Power Density Pulse Magnetron Sputtering - Process and Film Properties. In 13th International Conference on Plasma Surface Engineering September 10 - 14, 2012, in Garmisch-Partenkirchen, Germany (Vol. 2, pp. 80–83). Linköping University Electronic Press. https://doi.org/10.3384/wcc2.80-83
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