Evaluation of physical and mechanical properties of particleboard made from petung bamboo using sucrose-based adhesive

Abstract

Bamboo is a potential non-wood lignocellulosic material from which to make particleboard. Sucrose-based adhesive is another potential ingredient, but its use in particleboard has been limited. Addition of ammonium dihydrogen phosphate (ADP) can be used to increase the bonding ability of sucrose-based adhesive and to reduce the required pressing temperature. Therefore, this research used different pressing temperatures and sucrose/ammonium dihydrogen phosphate (ADP) composition ratios to optimize the properties of particleboards. The physical and mechanical properties of the boards were analyzed and compared with the JIS A 5908 (2003) standard for particleboard. The results showed that the interaction of the sucrose-ADP composition ratio and the pressing temperature significantly affected the physical and mechanical properties of the particleboards. The particleboard using only sucrose as adhesive had optimum properties at 200 *C; however, after addition of ADP, the intended properties could be achieved at a 160 °C pressing temperature.