Non-Heat Assistance Plasma-Enhanced Chemical Vapor Deposition of SiC x N y O z Film Using Monomethylsilane, Nitrogen and Argon

Abstract

Without any heating assistance, a gas mixture of monomethylsilane, nitrogen and argon was used at 10-20 Pa for 5 min for forming a SiCxNyOz film under parallel plate plasma. By this process, a dense film thicker than 100 nm could be obtained. The film thickness could be expressed by an overall rate expression consisting of the gas partial pressures at the inlet. Based on the obtained equation, the dominant process for film formation was evaluated to be the result of the deposition and the etching. By calculation using a similar form, the film contents of silicon, carbon, nitrogen and oxygen could be reproduced. Thus, the film thickness and the contents were controllable by the technique developed in this study. (C) The Author(s) 2017. Published by ECS. This is an open access article distributed under the terms of the Creative Commons Attribution 4.0 License (CC BY, http://creativecommons.org/licenses/by/4.0/), which permits unrestricted reuse of the work in any medium, provided the original work is properly cited. All rights reserved.