Process development for 3D laser lithography

Abstract

The field of micro-electro-mechanical-systems (MEMS) grew out from the integrated circuit (IC) industry. So far the main fabrication techniques used in MEMS are planar technologies, which set limitations to the sensor/actuator design. Therefore greyscale (3D) technology seems to be the method for fabrication of three-dimensional structures in a single lithography and etching step. The idea in fabricating a 3D photoresist structure is the controlled transmission of UV light intensity during the exposure process. The result of this work is to provide a preliminary process solution for the formation of nearly arbitrarily shaped 3D forms in photoresist using Heidelberg Instrument DWL 66FS direct writing lithography tool. For this purpose, the investigation results of the exposure tool possibilities of the photoresist selection for 3D applications and as a real greyscale application, slopes with different angles, which will be used for making a tactile sensor, are provided. © 2014 WIT Press.