Reaction-Diffusion in the Cu–Sn System

Abstract

Cu-Sn diffusion couples were annealed at 190 to 220 C. Diffusion coefficients in the eta and epsilon phases were measured. Movement of Kirkendall markers suggests the preferential diffusion of Sn atoms by a vacancy mechanism. Cu- eta , alpha - eta , and delta - eta couples were annealed at 357 to 404 C. The results made it possible to predict what phase layer should grow preferentially in the reaction diffusion of five binary systems. 25 refs.