Communication—Conical TSV Filling within 30 Seconds

Abstract

Super bottom up filling of TSVs is achieved by using a new leveler NM. The leveler was characterized by CVS method, its inhibition role was exhibited at different rotating rates and concentrations. NM electrolyte built up TSVs from the bottoms and almost no deposition on the TSV walls. The electrolyte containing NM leveler was effective at a high current density for both periodic pulse reverse (PPR) current, and direct current (DC). The 2 mu m diameter and 16 ae m depth conical TSVs required 30 s for full filling by two steps which were the PPR current step and the DC step. (C) The Author(s) 2017. Published by ECS. All rights reserved.