Microfabrication Technologies for Interaction Circuits of THz Vacuum Electronic Devices

8Citations
Citations of this article
8Readers
Mendeley users who have this article in their library.

Abstract

Advances in manufacturing technology are allowing for the realization of interaction circuit with microstructures. The capability to produce small circuit structures is allowing new opportunities for vacuum electronic devices producing terahertz (THz) frequency radiation, which is impractical with traditional machining technology. This publication reviews recent progress on advanced microfabrication technologies applicable to interaction circuits of THz vacuum electronic devices, including LIGA/UV-LIGA (Ultraviolet Lithographic, Galvonoformung and Abformung), deep reactive ion etching (DRIE), micro/nano computer numerical control (CNC) milling, three-dimension (3D) printing, etc., and describes the current State-of-the-Art of their applications.

Cite

CITATION STYLE

APA

Li, X., & Feng, J. (2024, November 1). Microfabrication Technologies for Interaction Circuits of THz Vacuum Electronic Devices. Micromachines. Multidisciplinary Digital Publishing Institute (MDPI). https://doi.org/10.3390/mi15111357

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free