Effect of microstructure on the high temperature strength of nitride bonded silicon carbide composite

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Abstract

Four compositions of nitride bonded SiC were fabricated with varying particle size of SiC of ∼ 9.67, ∼ 13.79, ∼ 60 μ and their mixture with Si of ∼ 4.83 μ particle size. The green density and hence the open porosity of the shapes were varied between 1.83 to 2.09 g/cc and 33.3 to 26.8 vol.%, respectively. The effect of these parameters on room temperature and high temperature strength of the composite up to 1300°C in ambient condition were studied. The high temperature flexural strength of the composite of all compositions increased at 1200 and 1300°C because of oxidation of Si3N4 phase and blunting crack front. Formation of Si3N4 whisker was also observed. The strength of the mixture composition was maximum.

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Rakshit, J., & Das, P. K. (2002). Effect of microstructure on the high temperature strength of nitride bonded silicon carbide composite. Bulletin of Materials Science, 25(5), 387–390. https://doi.org/10.1007/BF02708015

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