Electrochemical deposition of silver on aluminum alloys

Abstract

Silver coatings have a very high reflection ability. To avoid their darkening from the hydrogen sulphide in the air, a thin layer of heat-resistant colorless lacquer is applied to the coatings. Silver plating is mainly used in jewelery, optics, electronics and electrical engineering. Depending on their application the thickness of the layer may vary from 2 to 24 µm. It can be done in several ways: chemical, electrochemical, contact, etc. The most common way of silver plating is the electrochemical deposition using cyanide and non-cyanide electrolytes. The cyanide electrolytes produce light, fine crystalline, dense and plastic coatings upon silver-plating. Usually silver coatings are applied with copper or nickel intermediate layer. In order to improve the de-oxidation of the aluminum surface new chemical treatment in acid - alkaline solution was applied. Our previous research shows that the presence of diamond nanoparticles in the electrolyte increase the metal deposition. Samples were prepared from electrolyte containing 10 g/l diamond nanoparticles. Their properties were compared to the properties of reference samples. The diamonds were obtained by detonation synthesis. The aim of this study is to obtain electrochemically deposited silver layer with high density, adhesion and electric conductivity on aluminum alloys substrate. The coating was directly plated without intermediate layer. Non-cyanide electrolyte composition and electrochemical parameters were determined in order to produce Ag coatings on Al alloy substrate without intermediate layer. The coating is with good adhesion, density and thickness of 14-23 μm.