The Development of Low-Temperature Lead-Free Solders using Sn-Bi Solders Alloys

Abstract

Lead-free solders have been the substructure innovation of electronic interconnections for many decenniums due to the widespread utilization of electronic contrivances. Sn-Ag–Cu (SAC) is presently seen as the popular lead-free solder alloy for bundling interconnects in the electronics industry. In this review, the study on the development of low-temperature Pb-free solders using Sn-Bi solder alloys will be discussed regarding thermal behaviour and wettability. The impact of alloying on these compounds is depicted as far as basic microstructural changes, mechanical properties, and reliability. The review closes with a perspective for cutting edge electronic interconnect materials.