Temperature/Stress distributions in a stress-relief-type plate of functionally graded materials under thermal shock

Abstract

This paper presents a numerical technique for analyzing one-dimensional transient temperature and stress distributions in a stress-relief-type plate of functionally graded ceramic-mental based materials (FGMs), in relation to both the temperature-dependent thermal properties and continuous and gradual variation of the thermomechanical properties of the FGM. The FGM plate is assumed to be initially in steady state of temperature gradient, suffering high temperature at the ceramic side and low temperature at the metallic side associated with its in-service performance. The FGM plate is then rapidly cooled at the ceramic side of the plate by a cold medium. The transient temperature and related thermal stresses in the FGM plate are analyzed numerically for a model alumina-nickel FGM system. The proposed analytical technique for determining the temperature distribution is quite simple and widely applicable for various boundary conditions of FGMs, compared with methods recently proposed by other researchers. The optimum composition of FGMs is also discussed to reduce the thermal stresses in the FGM plate, relating to the function of the volume fraction of the metal across the thickness.