Conference Proceedings

Size and substrate effects upon undercooling of Pb-free solders

IMPACT Conference 2009 International 3D IC Conference - Proceedings (2009) 662-665
DOI: 10.1109/IMPACT.2009.5382274
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Huang, Y. C., Wu, K. S., & Chen, S. W. (2009). Size and substrate effects upon undercooling of Pb-free solders. In IMPACT Conference 2009 International 3D IC Conference - Proceedings (pp. 662–665). https://doi.org/10.1109/IMPACT.2009.5382274

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