Carbon Plug Application in 3D NAND Fabrication

Abstract

The most efficient way to increase storage capacity is to add more layers stacked in 3D NAND device. Carbon plug fill and carbon CMP processes are implemented at the 1st tier deck channel holes to protect the damage from 2nd tier deck HAR etch drilling. Coventor SEMulator3D is adopted to speed up the process tuning of deposition/etch/deposition carbon plug fill-in. High selectivity carbon CMP process removes the overburden of carbon material then keep the flatness with good defect performance are the key module for multi-tiers decks in 3D NAND fabrication.