Removable fast package technology for MEMS devices using polymer connectors and silicon sockets

Abstract

This paper describes a novel removable and reusable packaging technique that can act as temporary protection for suspended microelectromechanical system (MEMS) devices during dicing and handling. The technique uses a polymer cover with built-in flexible connectors and is prepared using a molding process, and then mechanically interlocked to the MEMS device with built-in socket arrays. The shapes of the polymer connector and the silicon sockets are easily patterned and tuned using microfabrication processes. The press-fit design of the connectors and the sockets, and the hydrophobic characteristic of the polymers provide waterproofing protection. We have demonstrated that the interlocking of modified SCREAM devices with the PDMS polymer cover was demonstrated at a typical interlocking strength of approximately 1 MPa. © 2007 IOP Publishing Ltd.