Development of a simple dielectric analysis module for online cure monitoring of a commercial epoxy resin formulation

Abstract

The final properties of thermosets are strongly dependent on their curing process. Therefore, closely monitoring this process is necessary to assure the manufacturing quality and productivity. In this way, the aim of this study is to develop a simple dielectric module for monitoring and optimizing the industrial curing cycle of thermosets. The module is based on a data acquisition system and an interdigital sensor that remains in contact with the resin throughout the entire curing process. Dielectric analysis (DEA) was performed in a commercial epoxy resin formulation widely used as a matrix for thermoset composites, which was submitted to a pre-established and validated curing cycle. The properties derived from DEA measurements are in accordance with differential scanning calorimetry (DSC) results, allowing the identification of key stages of the curing process. The similarity between the results of both techniques is a strong indicative of the possibility of using the developed module as an alternative for industrial cure monitoring and optimization.