Abstract
An accumulative roll bonding process was applied up to 8 cycles on high-purity aluminum, aluminum0.02 mass%iron and aluminum0.2 mass%iron in order to measure electrical properties in addition to the mechanical properties. Ultimate tensile strength increases about 35 times compared with that of coarse grain metals, whereas, the electrical conductivity at room temperature decreases about a few %IACS. The dislocation density and density of grain boundary were evaluated from XRD and SEM/EBSD measurements. The microstructure change in those parameters explains the change in electrical resistivity measured at 77 K.
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Miyajima, Y., Fukuda, K., Adachi, H., Fujii, T., & Kato, M. (2020). Change in Mechanical and Electrical Properties of Accumulative Roll Bonding Processed High-Purity Aluminum, Al-0.02mass%Fe and Al-0.2mass%Fe Alloys. Materials Transactions, 61(2), 305–310. https://doi.org/10.2320/matertrans.L-M2019864
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