Abstract
A 30x30 nm2 HfOx resistance random access memory (RRAM) with excellent electrical performances is demonstrated for the scaling feasibility in this work. A 1 Kb one transistor and one resistor (1T1R) array with robust characteristics was also fabricated successfully. The device yield of the 1 Kb array is 100%, and the endurance for these devices can exceed 106 cycles by a pulse width of 40 ns. Two effective verification methods, which make a tight distribution of high resistance (RHIGH) and low resistance (RLOW) are proposed for the array to ensure a good operation window. A thin AlOx buffer layer under the HfOx layer was adopted to enhance the read disturb immunity. Without large parasitic capacitance, the 1T1R RRAM devices exhibit excellent program(PGM)/erase(ERS) disturb immunity. © 2009 IEEE.
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CITATION STYLE
Chen, Y. S., Lee, H. Y., Chen, P. S., Gu, P. Y., Chen, C. W., Lin, W. P., … Tsai, M. J. (2009). Highly scalable hafnium oxide memory with improvements of resistive distribution and read disturb immunity. In Technical Digest - International Electron Devices Meeting, IEDM. https://doi.org/10.1109/IEDM.2009.5424411
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