Reducing soldering defects in mobile phone manufacturing company: A DMAIC approach

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Abstract

A DMAIC (an effective tool) approach has been presented in this paper for reducing defects in soldering in an endeavor to approach six sigma quality level in a mobile phone manufacturing company. DMAIC helps expose and kill the root causes of defects in the process and thereby helps achieve higher customer satisfaction by means of improved quality. The case study was conducted in an electronics manufacturing industry engaged in an assembly of mobile phones. Post successful implementation of Six sigma - DMAIC in the assembly processes, ppm defectives dipped from 3800 to 200, which is a massive 94.74 percent reduction in ppm defectives.

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APA

Garg, A., Raina, K., & Sharma, R. (2020). Reducing soldering defects in mobile phone manufacturing company: A DMAIC approach. In IOP Conference Series: Materials Science and Engineering (Vol. 748). Institute of Physics Publishing. https://doi.org/10.1088/1757-899X/748/1/012027

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