Ambiphilic Al−Cu Bonding

  • Liu H
  • Schwamm R
  • Hill M
  • et al.
N/ACitations
Citations of this article
5Readers
Mendeley users who have this article in their library.

This article is free to access.

Abstract

Copper‐alumanyl complexes, [LCu‐Al(SiN Dipp )], where L=carbene=NHC iPr (N,N′‐diisopropyl‐4,5‐dimethyl‐2‐ylidene) and Me2 CAAC (1‐(2,6‐diisopropylphenyl)‐3,3,5,5‐tetramethyl‐pyrrolidin‐2‐ylidene) and featuring unsupported Al−Cu bonds, have been prepared. Divergent reactivity observed with carbodiimides and CO 2 implies an ambiphilicity in the Cu–Al interaction that is dependent on the identity of the carbene co‐ligand.

Cite

CITATION STYLE

APA

Liu, H., Schwamm, R. J., Hill, M. S., Mahon, M. F., McMullin, C. L., & Rajabi, N. A. (2021). Ambiphilic Al−Cu Bonding. Angewandte Chemie, 133(26), 14511–14514. https://doi.org/10.1002/ange.202104658

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free