Abstract
Copper‐alumanyl complexes, [LCu‐Al(SiN Dipp )], where L=carbene=NHC iPr (N,N′‐diisopropyl‐4,5‐dimethyl‐2‐ylidene) and Me2 CAAC (1‐(2,6‐diisopropylphenyl)‐3,3,5,5‐tetramethyl‐pyrrolidin‐2‐ylidene) and featuring unsupported Al−Cu bonds, have been prepared. Divergent reactivity observed with carbodiimides and CO 2 implies an ambiphilicity in the Cu–Al interaction that is dependent on the identity of the carbene co‐ligand.
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CITATION STYLE
Liu, H., Schwamm, R. J., Hill, M. S., Mahon, M. F., McMullin, C. L., & Rajabi, N. A. (2021). Ambiphilic Al−Cu Bonding. Angewandte Chemie, 133(26), 14511–14514. https://doi.org/10.1002/ange.202104658
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