Abstract
Chemical vapor deposition (CVD) is a vital process for deposit of thin films of various materials with precise control over the thickness, composition, and properties. Understanding the mechanisms of heat and mass transfer during CVD is essential for optimizing process parameters and ensuring high-quality film deposition. This review provides an overview of recent advancements in heat and mass transfer modeling for chemical vapor deposition processes. It explores innovative modeling techniques, recent research findings, emerging applications, and challenges in the field. Additionally, it discusses future directions and potential areas for further advancement in CVD modeling.
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CITATION STYLE
Łach, Ł., & Svyetlichnyy, D. (2024, July 1). Recent Progress in Heat and Mass Transfer Modeling for Chemical Vapor Deposition Processes. Energies . Multidisciplinary Digital Publishing Institute (MDPI). https://doi.org/10.3390/en17133267
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