DSC cure studies of high performance epoxy resins i. the reaction with 4, 4′-diaminodiphenyl sulfone (dds)

Abstract

Dynamic and isothermal cure kinetics of three different formulations composed of a new tetraglycidyl epoxy resin and diaminodiphenyl sulfone (DDS) were analyzed by differential scanning calorimetry. An autocatalytic kinetic model with the overall reaction order of 2 was modified for adequately describing the cure kinetics. Compared to previous calculation of kinetic parameter, the modified calculation fitted well with the experimental results. Higher cure temperature and higher DDS concentration led to an increase in the cure rate. Cure process of epoxy was dependent on the structure and functional group of epoxy resin. At the low DDS concentration, second exotherm peak was observed at approximately 50% conversion. Dynamic kinetic parameters were larger than isothermal kinetic parameters. © 1991 The Society of Polymer Science, Japan.