Abstract
IC manufacturers use automatic test equipment to keep costs down. Since automatic equipment can test a regulator in less than a second, there is little heating of the device during the test sequence. Manufacturers therefore specify most parameters at constant-junction temperature, while temperature drift is specified separately. A device user, however, should realize that during bench tests and in actual application a regulator will seldom be operated at a constant-junction temperature. And, unfortunately, line and load regulation are temperature-dependent parameters. This article presents a technique for avoiding heating during tests.
Cite
CITATION STYLE
Hnatek, E., & Goldstein, L. (1973). DON’T GET BURNED! Electronic Design, 21(5), 72–75. https://doi.org/10.2469/cfm.v28.n2.11
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