Curing kinetics and thermal properties of imide containing phthalonitrile resin using aromatic amines

Abstract

Due to their outstanding properties, phthalonitrile based polymers plays an important role in high performance advanced materials evaluated depending upon their curing process and mechanism. Henceforth it is necessary to understand the curing kinetics of bisphthalonitrile monomer having imide linkage using 4, 4’-diaminodiphenylsulfone (DDS) as curing agent for further investigations. Thus, curing kinetics was investigated by recording non-isothermal differential scanning calorimetric (DSC) scans at heating rates of 5 °C, 10 °C, 15 °C and 20 °C/min. Activation energy for bisphthalonitrile/4, 4’-diaminodiphenylsulfone (DDS) system was calculated using Starink method and results give a substantial evidence that Arrhenius activation energy (Ea) are certainly dependent on the structure of monomer and curing agent. The cured FIPN/DDS, ODPA-PN/ DDS systems show comparable high thermal stability and elevated glass transition temperature as compared to Bis-ADPN/ DDS composition. Subsequently, this composition exhibits comparative heat resistance and improved moisture resistance.