Abstract
The paper addresses the problem of analyzing the performance degradation caused by noise in power supply lines for deep submicron CMOS devices. We first propose a statistical modeling technique for the power supply noise including inductive ΔI noise and power net IR voltage drop. The model is then integrated with a statistical timing analysis framework to estimate the performance degradation caused by the power supply noise. Experimental results of our analysis framework, validated by HSPICE, for benchmark circuits implemented on both 0.25 μ, 2.5 V and 0.55 μ, 3.3 V technologies are presented and discussed. The results show that on average, with the consideration of this noise effect, the circuit critical path delays increase by 33% and 18%, respectively for circuits implemented on these two technologies.
Cite
CITATION STYLE
Jiang, Y. M., & Cheng, K. T. (1999). Analysis of performance impact caused by power supply noise in deep submicron devices. In Proceedings - Design Automation Conference (pp. 760–765). IEEE. https://doi.org/10.1145/309847.310053
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