Study on chatter suppression in ultrasonic-assisted grinding of thin-walled workpiece of SiCp/Al composites

9Citations
Citations of this article
5Readers
Mendeley users who have this article in their library.

This article is free to access.

Abstract

To suppress chatter is very important for ensuring processing quality and efficiency in ultrasonic-assisted grinding of thin-walled workpiece of SiCp/Al composites. Based on the chatter mechanism analysis, a stability analysis model is built and the analytical method is proposed. The cutting parameters can be selected reasonably based on the lobe diagram of stability, and the experiments were conducted using the parameters of selected points on lobe diagram. The experimental results show that the cutting force and surface roughness of unstable points are much larger than that of stable points, the vibration marks appear on the workpiece surface with unstable machining, and the surface quality is better in stable machining, which indicate that the chatter could be suppressed by this method to guarantee machining quality and efficiency.

Cite

CITATION STYLE

APA

Dong, X. W., Li, Z. A., Bian, L., Wang, M., Jin, Z. B., & Li, Q. D. (2023). Study on chatter suppression in ultrasonic-assisted grinding of thin-walled workpiece of SiCp/Al composites. Advances in Mechanical Engineering, 15(6). https://doi.org/10.1177/16878132231177995

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free