3D packaging and Moore's Law

Abstract

This paper describes how the semiconductor industry has seen steady improvements in key metrics such as performance, power consumption, and area, but as the semiconductor industry shrinks in device size and the technical challenges of ever-increasing performance demands, it is critical to improve chip performance for maximizing the operating frequency of individual ICs and reducing their power consumption. But when talking about improving chip performance, it is important not to focus solely on the individual integrated circuit (IC), but to evaluate it as part of the overall system. For example, as microprocessor frequency increases, so does the demand for main memory data. However, if the connections between the chips that transfer data to the processor do not keep pace with the increase in performance, these connections can become a bottleneck in the performance of the entire system. Instead, this paper describes a typical architecture for semiconductor 3D integration, highlights the technology choices for 3D integration implementation, and analyzes and explains the design challenges it presents. After outlining the above, this paper also analyzes the applications and achievements of 3D integration technology in recent years.