Galvanostatic Pulse Plating of Copper and Copper (I) Halides from Acid Copper (II) Halide Solutions

Abstract

CuX (X = Cl or Br) is formed during the galvanostatic pulse plating of copper from acid solutions containing Cu 2+ and X − . The reaction Cu 2+ + Cu° + 2X − → 2CuX occurs in the relaxation period of the pulse. Copper (I) chloride anodes for reserve seawater batteries may be made by this method. CuBr is oriented in the {220} plane when deposited on copper foil with the {200} plane uppermost. CuCl tends to dissolve in solutions containing Cl − to give soluble copper (I) halides. Corrosion rates at pure copper were determined from the pulse-plating experiments. © 1983, The Electrochemical Society, Inc. All rights reserved.