Characterization of Thin Films Deposited by Physical Vapor Deposition (PVD), Using Electrochemical Impedance Spectroscopy (EIS) Technique

Abstract

In this paper the performance against corrosion of a thin film of NiCu deposited by Physical Vapor Deposition at two different times of deposition, was evaluated. Electrochemical Impedance results in NaCl solution, showed a gradual increase in resistivity due to the degradation of the film (delamination) for both times, along with the deposition of corrosion products on the coating generated by re-combination of substrate oxides.