Investigation on critical strain of dynamic recrystallization for SiCp/Al-Cu composite

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Abstract

Using Gleeble-1500D simulator, the critical strain of dynamic recrystallization of SiCp/Al-Cu composite were investigated at 623-773 K with strain rate of 0.01-10 s -1. The results show that the main softening mechanism is the dynamic recrystallization through the stress-strain curves of SiCp/Al-Cu composite, the activation energy is 272.831 KJ/mol. lnθ-ε and (-∂(lnθ)/∂ε)-ε) curves were plotted based on the experimental data to further obtain the critical strain and steady strain of DRX. Then the critical strain model and the steady-state strain model of DRX were set up. Furthermore, the dynamic recrystallization volume fraction of SiCp/Al-Cu composite was investigated.

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Sun, Y., Xie, J., Hao, S., Wang, A., Liu, P., & Li, M. (2015). Investigation on critical strain of dynamic recrystallization for SiCp/Al-Cu composite. In IOP Conference Series: Materials Science and Engineering (Vol. 87). Institute of Physics Publishing. https://doi.org/10.1088/1757-899X/87/1/012046

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