Micro- and Nano-Structuring of Materials via Ultrashort Pulsed Laser Ablation

Abstract

Laser material processing has been demonstrated as an effective means for machining almost every solid material. The quality of laser machining depends on the processing parameters that dictate material ablation mechanisms. The understanding of the complex physics associated with ultrashort pulsed laser (USPL) material interaction and ablation has advanced significantly owing to a great many theoretical and experimental studies in the past 20 years. To date, USPLs have been considered as a novel tool for micro-and nano-machining of bulk or thin film materials and for internal modification of transparent materials via multi-photon absorption in a tiny focal volume. Moreover, USPL material processing is now gaining interest in other applications, such as in sensors, electronics and medical device industries.