Abstract
Reliable solder joints can be made on gold metallised microcircuits using lead-indium solders providing certain important conditions are understood and carefully controlled. This paper reviews the three fundamental concepts of scavenging, wetting, and ageing, which are relevant when soldering to gold films.
Cite
CITATION STYLE
APA
Yost, F. G. (1977). Soldering to gold films. Gold Bulletin, 10(4), 94–100. https://doi.org/10.1007/bf03215439
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