Fundamental issues related to flow boiling and condensation in microchannels-experimental challenges and opportunities

Abstract

In recent years, application of the microchannels has received considerable attention due to their capability for thermal management of microelectronic equipment, high power devices and development of compact evaporators. The present paper focuses at a discussion of the heat transfer during flow boiling and condensation in microchannels of the heat sink to identify the methods to improve heat transfer performance and select the physically based models for heat transfer prediction. The main purpose of this study is to discuss the mechanisms of heat transfer in microchannels at different aspect ratio for the three-sided heating case using the experimental data were obtained for refrigerant R134a and dielectric fluid.