A Study on the Morphology, Mechanical, and Electrical Performance of Polyaniline-modified Wood - A Semiconducting Composite Material

Abstract

This study investigated the morphology, electrochemical modification with respect to the wood fiber direction, and mechanical properties of wood modified by in situ polymerization with polyaniline (PANI). This polymerization formed a composite material with applications as an antistatic, electromagnetic, anti-corrosion, and heavy metal purifying materials. The polymer was found throughout the entire structure of the wood and was quantified within the wood cell wall and middle lamella by SEM-EDX. The presence of PANI affected the conductivity of the composite specimens, which was found to be higher in the fiber direction, indicating a more intact percolation pathway of connected PANI particles in this direction. The PANI modification resulted in a small reduction of the storage modulus, the maximum strength, and the ductility of the wood, with decreases in the properties of specimens conditioned in an environment above 66% relative humidity. The in situ-polymerized PANI strongly interacted with the lignin component of the veneers, according to the decrease in the lignin glass transition temperature (Tg) noted in DMA studies.