Journal ArticleOPEN ACCESS

Silicon-Photonics-Embedded Interposers as Co-Packaged Optics Platform

  • Takemura K
  • Ohshima D
  • Noriki A
  • et al.
Transactions of The Japan Institute of Electronics Packaging (2022) 15(0) E21-012-1-E21-012-13
DOI: 10.5104/jiepeng.15.e21-012-1
N/ACitations
Citations of this article
8Readers
Mendeley users who have this article in their library.

Cite

CITATION STYLE

APA

Takemura, K., Ohshima, D., Noriki, A., Okamoto, D., Ukita, A., Ushida, J., … Nakamura, T. (2022). Silicon-Photonics-Embedded Interposers as Co-Packaged Optics Platform. Transactions of The Japan Institute of Electronics Packaging, 15(0), E21-012-1-E21-012–013. https://doi.org/10.5104/jiepeng.15.e21-012-1

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free