Splat Behaviour Under Substrate Temperature Of 673K Via Coupling Simulation

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Abstract

The process of collision flattening is difficult to evaluate via experiment because is normally under rapid conditioned (in μsec). Via simulation, under compressible flow condition we propose a moving particle semi implicit method (MPS) coupling with finite volume method (FVM) to examine the deformation, splitting and conjoining of liquid. The substrate temperature has been constant at 673K. The result shows that the phenomena of splat behavior have been successfully being observed. The validation of droplet flow field also being confirm visually. Besides, the substrate temperature also influences the shape of the splat.

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Mohd Noh*, M. H., Abdul Hamid, A. H., & Mori, K. (2019). Splat Behaviour Under Substrate Temperature Of 673K Via Coupling Simulation. International Journal of Recent Technology and Engineering (IJRTE), 8(4), 6886–6890. https://doi.org/10.35940/ijrte.d5211.118419

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