An Exploration of Grain-Averaged Stress Measurement Using Partial Unloads with In situ Microscopic Image Correlation

Abstract

Background: In polycrystal mechanics, determination of stress is associated with diffraction methods that measure (the inherently-related) elastic strain. Microscopic digital image correlation (DIC), while commanding much higher intragranular resolution, measures total strain, and its local accuracy is typically insufficient to evaluate elastic strain magnitudes. Objective: In situ DIC measurements over a partial unload of the polycrystal, where strains are virtually elastic, are explored for grain-averaged elastic strains and then, through a posed formalism, the stresses at the point of unload. Grain averaging is functionally employed to improve the DIC accuracy. The large objective is to emulate in situ complementary diffraction. Methods: Nickel with high elastic anisotropy is chosen. The utilized highly-automated instrument offers maximal resolution for DIC with optical microscopy over a gross grain field. Orientations are predetermined for the same grain layer via electron backscatter diffraction. High-accuracy grain masks are produced to isolate the strain fields of individual grains. Results: Very promising results are shown over a number of grains with sensible apparent compliance and stress values as well as linear unload behavior. Grains with sane results are largely predicted by a posed objectivity test that relies on DIC repeated with multiple reference loads. Conclusion: Though it will require extremely careful implementations of microscopic DIC with high intragranular resolution, the premise of measuring intergranular stress fields via partial unloads seems to be viable and worthy of further exploration and verification. This capability that is superposed over strain measurement offers a more stringent validation of high-fidelity crystal plasticity models.